ATI Leadership

Nick Andreou – CEO Segula Technologies | USA 

Nick Andreou has been in the Detroit Automotive sector since his graduation from GMI (now Kettering) over thirty (30) years ago. General Motors provided Nick a diverse and enriched career, with responsibilities in Manufacturing, R&D, Product Development, Systems Engineering, Virtual Manufacturing, Global Engineering and IS&S.

Employment with Siemens and Oldcastle augmented Nick’s perspective to include experience as an Engineering and IT Service Provider. Nick earned his PMP, Masters of Engineering Management (U of Detroit) and Executive Post Graduate training (Harvard).

When Segula Technologies Inc. Named Nick as their CEO for the United States in 2015, the team started with five (5) engineers. By mid-year 2017 the team has grown to over two hundred and forty (240), with strong potential for additional, significant growth.

Karl Sponsler – Director of Engineering and Resources

Karl has over 30 years of product engineering experience across many industries, including automotive, consumer products, and medical devices. He has been a leader at Griswold Engineering, Inc. – now Segula Griswold, Inc. – since 2010. Prior to that, he worked for 23 years at Johnson Controls, Inc. primarily in mechanism product engineering, serving as Chief Engineer for several years. He graduated from The Ohio State University with a Bachelor of Science in Mechanical Engineering in 1985 and holds several patents.

Scott Chapman – Director of Engineering Programs

Mr. Chapman is co-responsible for Business Development at Applied Technology Integration (now Segula ATI).

He earned a Bachelor of Science from Bowling Green State University. Prior to joining ATI, Mr. Chapman held a design and engineering position at Honeywell International supporting the automotive industry. He has been with ATI since 2007 in various roles including design, engineering and project management. He is an active member of SAE and NDIA and sits on the Advisory Committees for several local Universities.